会议名称：“2021世界木材日”研讨会暨第三届国际林联（IUFRO） 林产品文化研究组讨论会
会议时间：2021年3月21日

报告嘉宾：Byung-Dae PARK
嘉宾简介：Professor of Department of Wood Science and Technology, Kyungpook National University

摘要：
As the supply of large diameter logs decreases, bonding small size woods with adhesives is an important way of extending the use of wood products that can replace energy intensive materials with carbon dioxide emission. The formaldehyde emission (FE) from wood products bonded with urea-formaldehyde (UF) resins is a critical and limiting factor of using them. This presentation discusses recent progresses on the FE from wood products bonded with UF resin adhesives that had been used for more than 100 years since their first development in 1884. Low FE was obtained by lowering formaldehyde/urea (F/U) molar ratio of UF resins at the expense of poor adhesion in wood-based panels such as plywood, particleboard, and medium density fiberboard (MDF). Recent progresses show that hydrogen bonds between linear molecules of low molar ratio UF resins forms crystalline domains instead of building three-dimensional network structure, a strength backbone of thermosetting resins. The modification of low molar ratio UF resins with modified nanoclay decreased their crystallinity, and improved the FE and adhesion of wood-based composite products at the same time. This innovation is expected to provide a path of extending the use of wood-based panels in future.

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